资源库
应用注释
返回到资源库

Au Area Ratio Measurement for Bonded Surfaces after Bump Abruption


Au remaining on the bonding surface after bump separation_ob50×z4×_BF
Au Bump

1. Background

As package miniaturization and space-reduction technologies enhance overall product performance in contemporary electronic devices, Flip-Chip Bonding (FCB) – characterized by a small mounting footprint and reduced wiring distance – applications are increasing.

2. Application

Flip-Chip Bonding involves the bonding of on-chip electrodes to printed circuit board (PCB) electrodes through Au bumps. Without incorporating additional wiring, the bond strength directly influences the circuit’s conductivity. Since bond alloying contributes to reinforced bond strength, measuring the area ratio of non-alloy Au electrodes enables inspectors to confirm the degree of bond between the bump and the circuit board.

3. The Olympus solution

The Olympus DSX digital microscope achieves resolutions comparable to state-of-the-art optical microscopes through the incorporation of high-NA/low-aberration field lenses. Extended Focal Image (EFI) technology allows users to acquire clear imagery across the entire field, even for difficult-to-focus surface configurations. Acquired images are directly transmitted via OLYMPUS Stream software for measurement. Users may further refine the measurement area through HSV settings.

Au remaining on the bonding surface after bump separation_ob50×z4×_BF_ROI

Brightfield Imagery: 50X field lens with 4X zoom

Au remaining on the bonding surface after bump separation_manual

Manual HSV threshold settings

Au remaining on the bonding surface after bump separation_ob50×z4×_BF_ROI_Count and Measure

ROI designation / measurement result

Olympus IMS
应用所使用的产品

图像和结果更优良。DSX1000 数码显微镜凭借有保证的准确度和重复性,可实现更快速的失效分析。

MX 63 和 MX63L 显微镜系统具有多种功能,采用符合人体工学的易用设计,能够提供最大 300mm 晶圆、平板显示器、印刷电路板、以及其他大型样本的高品质观察。该产品采用灵活的模块设计,能够提供适用于多种检查用途的最佳观察系统。通过与奥林巴斯 Stream 图像分析软件结合,从观察到报告生成在内的整体检查过程都变得简单而流畅。
奥林巴斯Stream图像分析软件提供用户图像采集、定量测量、报告和流程式操作模式的高级材料分析功能。
Sorry, this page is not available in your country
Let us know what you're looking for by filling out the form below.

This site uses cookies to enhance performance, analyze traffic, and for ads measurement purposes. If you do not change your web settings, cookies will continue to be used on this website. To learn more about how we use cookies on this website, and how you can restrict our use of cookies, please review our Cookie Policy.

OK